JUKI Smart-Solution

High-Speed Performance of 50,000 CPH

• Laser sensors are positioned close to the substrate, reducing the movement time from component pickup to placement, thereby achieving an ultra-high speed of 50,000 CPH* for single-head pick-and-place machines.
• *Under optimal conditions

Height-Adjustable "Takumi HEAD" with Recognition Sensors

• The "Takumi HEAD" equipped with 8 nozzles features laser sensors that automatically adjust their height according to the component height for component shape recognition, enabling precise pickup and placement.
• It achieves optimal cycle times for placing components of varying heights, ranging from ultra-small components to large-sized components.

Laser Recognition Technology

• Capable of recognizing a wide variety of component shapes, from ultra-small 03015 components to large □5mm components such as BGA, SOP, and QFP. Laser recognition is not affected by variations in electrode shape or gloss, ensuring stable component identification and placement. In addition, component data creation is simplified, allowing for quick setup of new component information.

Broad Component Compatibility

• The applicable component size range spans from 03015 to □74mm, with support for 50mm × 150mm components as well. The maximum compatible component height is 25mm, making it suitable for a wide array of component placement applications.

Capacity for 112 Feeders

• Featuring compact, lightweight, and thin-profile RF Feeders, the machine can accommodate up to 112 feeders in total (front and rear combined). This reduces setup frequency, supports diverse component types, and enables efficient high-mix low-volume production. *When using RF Feeders (RF08AS)

New-Generation Coplanarity Detection Sensors

• Detects lead lifting in leaded components and solder ball deformation in BGA components, preventing placement of defective components. High-precision coplanarity detection enhances the overall reliability of the final products.

Product Specifications